Tam sim no dav siv machining txoj kev xws li txiav, sib tsoo, polishing, thiab lwm yam, vim muaj micro-cracks nyob rau hauv cov ntaub ntawv ua tiav los yog cov tsis xws luag nyob rau hauv lub crystallization, txawm yuav ua li cas los txhim kho lub machining raug thiab txhim kho cov khoom siv machining, yeej muaj tej yam kev txwv. Xib fwb Mori Yongzheng, Kws qhia ntawv ntawm Engineering, Osaka University, Nyiv, tau npaj ib txoj kev ua tshiab uas siv cov roj chemical, hu ua plasma CVM method, uas yog ib qho kev siv technology uas siv atomic tshuaj tiv thaiv kom tau txais qhov chaw ultra-precise. Nws txoj hauv kev ua haujlwm Zoo li plasma etching, hauv plasma, cov dawb radicals ua rau lub ntsej muag ntawm lub workpiece, tig lawv mus rau hauv cov molecules volatile, thiab cov txheej txheem yog paub los ntawm cov pa evaporation, thiab cov ntshav yog generated nyob rau hauv siab. , muaj peev xwm tsim kom muaj qhov ntom ntom heev
dawb radicals, yog li txoj kev ua no tuaj yeem ua tiav kev nrawm piv rau cov txheej txheem ua tshuab.
Thaum muaj kev kub ntxhov siab, lub plasma yog nyob ze ntawm cov electrodes vim qhov me me txhais tau tias tsis pub dawb ntawm cov roj molecules. Yog li nws tuaj yeem ua tiav los ntawm electrode scanning, O. Qhov chaw ntawm txhua qhov duab nrog qhov tseeb ntawm 01μm tuaj yeem ua tiav ib lub dav hlau siv lead ua silicon ntawm qhov nrawm ntawm 50μm / min, thiab qhov roughness ntawm cov khoom ua haujlwm tau ncav cuag 0.1nm (Rrms).
Nyob rau hauv lub xyoo tom ntej, CVM thev naus laus zis yuav siv rau hauv ntau qhov chaw xws li kev ua silicon nti thiab aspheric lens ua rau cov khoom siv hluav taws xob raug hluav taws xob. Tam sim no, qee tus neeg tab tom kawm txog kev sib xyaw ntawm CVM thiab EEM los ua cov atoms xws li X-ray tsom iav rau synchrotrons. Ib tug ca arbitrary nto.